Solid State Phenomena (Journal)

Average of the ratings by the respective reviewers for the peer review process.

followers0

following0

Registered Peer Reviews: [ 0 ]

Invited Reviewers Number of Reviewers joined to Reviewer Credits by your invitations. (Not peer review requests) : [ 0 ]

Solid State Phenomena (SSP) (formerly Part B of “Diffusion and Defect Data” 0377-6883) is a peer-reviewed periodical which covers a set of research: fundamentals of the structures and their influence on the properties of solids, of experimental techniques and practical applications of materials, solid-state devices and structures in the context of the latest achievements in the area of research of solid state phenomena.

This user account status is Approved

Profile Profile

Published by Trans Tech Publications Ltd..

Account

Reviewer Credits membership

Joined May 30, 2026

Journal title

Solid State Phenomena

Abbreviation

SSP

Country

Switzerland

Publisher’s name

Trans Tech Publications Ltd.

p-ISSN

1012-0394

Journal home page

https://www.scientific.net/SSP

Editor in chief First name

Rafał Leszek

Editor in chief Last name

Abdank-Kozubski

Research

Primary Research Topic

Engineering(all)

Topics

Engineering, Materials Science (miscellaneous)

Primary language

English

Languages

English

Is your journal linked to a scientific society?

Peer Review

An average number of peer-reviewed papers published in a year

160